Invention Grant
- Patent Title: Packaged integrated circuit device and methods
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Application No.: US15602974Application Date: 2017-05-23
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Publication No.: US10249557B2Publication Date: 2019-04-02
- Inventor: Leo M. Higgins, III , Burton Jesse Carpenter
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H01L23/62
- IPC: H01L23/62 ; H01L23/495

Abstract:
A packaged lead frame includes a encapsulant having a first minor side, a second minor side opposite the first minor side, a third minor side, and a fourth minor side opposite the third minor side, and a plurality of leads along the third minor side between the first minor side and a center plane between the first and second minor side. The plurality of leads extend outwardly from the encapsulant at a first plane. Each of the plurality of leads includes a corresponding jog external to the encapsulant which jogs away from the center plane, wherein the corresponding jog of each lead from a first lead of the plurality of leads closest to the center plane to a last lead of the first plurality of leads closest to the first minor side jogs incrementally further away the center plane.
Public/Granted literature
- US20180342444A1 PACKAGED INTEGRATED CIRCUIT DEVICE AND METHODS Public/Granted day:2018-11-29
Information query
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