Invention Grant
- Patent Title: Method for electromagnetic shielding and thermal management of active components
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Application No.: US15536185Application Date: 2015-12-22
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Publication No.: US10249572B2Publication Date: 2019-04-02
- Inventor: Kenichiroh Mukai , Kwonil Kim , Lee Gaherty , Lutz Brandt , Tafadzwa Magaya
- Applicant: Atotech Deutschland GmbH
- Applicant Address: DE Berlin
- Assignee: Atotech Deutschland GmbH
- Current Assignee: Atotech Deutschland GmbH
- Current Assignee Address: DE Berlin
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: EP14199574 20141222
- International Application: PCT/EP2015/002594 WO 20151222
- International Announcement: WO2016/102066 WO 20160630
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L23/552 ; H01L23/29 ; H01L23/31 ; H01L23/373 ; C23C18/16 ; C23C18/28 ; C23C18/30 ; C23C18/36 ; C23C18/40 ; C23C18/42 ; C23C18/50 ; C23C18/54 ; H01L21/48 ; H01L21/02
Abstract:
The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.
Public/Granted literature
- US20170330861A1 NOVEL METHOD FOR ELECTROMAGNETIC SHIELDING AND THERMAL MANAGEMENT OF ACTIVE COMPONENTS Public/Granted day:2017-11-16
Information query
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