Invention Grant
- Patent Title: Resin composition, bonded body and semiconductor device
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Application No.: US15766109Application Date: 2016-10-17
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Publication No.: US10249591B2Publication Date: 2019-04-02
- Inventor: Hiroto Akaike , Kazuhiko Yamasaki
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2015-212947 20151029; JP2016-150723 20160729
- International Application: PCT/JP2016/080704 WO 20161017
- International Announcement: WO2017/073393 WO 20170504
- Main IPC: H01L23/00
- IPC: H01L23/00 ; C09J9/02 ; C09J163/04 ; C09J163/10 ; C09J183/04 ; C09J175/04 ; C09J163/00 ; C08K3/08 ; C08K9/04 ; C08L101/00 ; H01L21/52
Abstract:
A resin composition is provided, including a binder resin, and silver-coated particles in which a functional group is introduced to a surface. A ratio (a/b) of Young's modulus (a) of the silver-coated particles to Young's modulus (b) of the binder resin after being cured is 0.1 to 2.0, and the Young's modulus (a) of the silver-coated particles is 0.05 to 2.0 GPa.
Public/Granted literature
- US20180286829A1 RESIN COMPOSITION, BONDED BODY AND SEMICONDUCTOR DEVICE Public/Granted day:2018-10-04
Information query
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