Invention Grant
- Patent Title: Solid-state image pickup device
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Application No.: US16013132Application Date: 2018-06-20
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Publication No.: US10249659B2Publication Date: 2019-04-02
- Inventor: Takayuki Ezaki , Teruo Hirayama
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP2004-028353 20040204
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L31/113 ; H01L27/148 ; H01L29/768 ; H01L31/06 ; H01L27/146 ; H01L29/423 ; H01L31/02
Abstract:
A solid-state image pickup device 1 according to the present invention includes a semiconductor substrate 2 on which a pixel 20 composed of a photodiode 3 and a transistor is formed. The transistor comprising the pixel 20 is formed on the surface of the semiconductor substrate, a pn junction portion formed between high concentration regions of the photodiode 3 is provided within the semiconductor substrate 2 and a part of the pn junction portion of the photodiode 3 is extended to a lower portion of the transistor formed on the surface of the semiconductor substrate 2. According to the present invention, there is provided a solid-state image pickup device in which a pixel size can be microminiaturized without lowering a saturated electric charge amount (Qs) and sensitivity.
Public/Granted literature
- US20180337205A1 SOLID-STATE IMAGE PICKUP DEVICE Public/Granted day:2018-11-22
Information query
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