Invention Grant
- Patent Title: Light emitting diode package and manufacturing method thereof
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Application No.: US15645632Application Date: 2017-07-10
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Publication No.: US10249801B2Publication Date: 2019-04-02
- Inventor: Kwang Yong Oh , Ho Jun Byun , Hyuck Jun Kim , Ki Bum Nam , Su Yeon Kim
- Applicant: Seoul Semiconductor Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2014-0106769 20140818; KR10-2014-0112542 20140827; KR10-2015-0076499 20150529
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/50 ; H01L33/48 ; C09K11/61 ; C09K11/77 ; C09K11/88

Abstract:
A light emitting diode package includes a light emitting diode chip disposed in a housing, a first phosphor configured to emit green light, and a second phosphor configured to emit red light. White light is configured to be formed by a synthesis of light emitted from the light emitting diode chip, the first phosphor, and the second phosphor. The second phosphor has a chemical formula of A2MF6:Mn4+, A is one of Li, Na, K, Rb, Ce, and NH4, and M is one of Si, Ti, Nb, and Ta, and the Mn4+ of the second phosphor has a mole range of about 0.02 to about 0.035 times the M.
Public/Granted literature
- US20170309796A1 LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-10-26
Information query
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