Invention Grant
- Patent Title: OLED packaging method and OLED package structure
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Application No.: US15505119Application Date: 2016-12-28
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Publication No.: US10249846B2Publication Date: 2019-04-02
- Inventor: Jiangjiang Jin , Hsianglun Hsu
- Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Wuhan, Hubei
- Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Wuhan, Hubei
- Agent Leong C. Lei
- Priority: CN201611180720 20161219
- International Application: PCT/CN2016/112531 WO 20161228
- International Announcement: WO2018/113005 WO 20180628
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56

Abstract:
The present invention provides an OLED packaging method and an OLED package structure. The OLED packaging method of the present invention is such that a silicon-doped diamond-like carbon layer and a diamond-like carbon scattering layer are both provided in an OLED package structure so that the silicon-doped diamond-like carbon layer may provide an effect of blocking external moisture and oxygen and the diamond-like carbon scattering layer is used to provide an effect of increasing light transmission rate, whereby it is possible to greatly extend the service life of the OLED device and also to ensure a relatively high light output efficiency of the OLED device. The OLED package structure of the present invention is such that a silicon-doped diamond-like carbon layer and a diamond-like carbon scattering layer are both provided, so that the silicon-doped diamond-like carbon layer may provide an effect of blocking external moisture and oxygen and the diamond-like carbon scattering layer is used to provide an effect of increasing light transmission rate, whereby it is possible to greatly extend the service life of the OLED device and also to ensure a relatively high light output efficiency of the OLED device.
Public/Granted literature
- US20180226614A1 OLED PACKAGING METHOD AND OLED PACKAGE STRUCTURE Public/Granted day:2018-08-09
Information query
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