Invention Grant
- Patent Title: Waterproof component with wiring structure
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Application No.: US15923309Application Date: 2018-03-16
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Publication No.: US10249979B2Publication Date: 2019-04-02
- Inventor: Isanori Shimizu , Kouichi Ohyama , Takeo Koga , Kazunori Miura
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2017-061087 20170327
- Main IPC: H01R13/73
- IPC: H01R13/73 ; H01R13/52 ; H01R13/516 ; H01R13/74 ; H02G3/22 ; B60R16/02

Abstract:
A waterproof component includes a housing body, a mat seal, mat seal cover, and an elastic ring. The housing body includes an attachment-hole-insertion portion having a mat-seal-accommodating chamber, an abutting portion to abut a first peripheral surface of the attachment hole, a locking claw provided on an insertion tip side of the attachment hole insertion portion, the locking claw to be locked to a second peripheral surface of the attachment hole, and a cover locking portion provided on an insertion tip side of the attachment-hole-insertion portion. The mat seal has an electric wire press-fitting hole. The mat-seal-accommodating chamber accommodates the mat seal. The mat seal cover locks to the cover-locking portion, the mat seal cover interposes the mat seal between the mat seal cover and a bottom wall of the mat-seal-accommodating chamber. The elastic ring is disposed on an outer periphery of the attachment-hole-insertion portion.
Public/Granted literature
- US10283901B2 Waterproof component with wiring structure Public/Granted day:2019-05-07
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