Invention Grant
- Patent Title: Mitigation of connector stub resonance
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Application No.: US15878624Application Date: 2018-01-24
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Publication No.: US10249989B2Publication Date: 2019-04-02
- Inventor: Clement Luk , Jeremy Buan , Tadashi Ohshida , Ching-Chao Huang
- Applicant: Hirose Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: HIROSE ELECTRIC CO., LTD.
- Current Assignee: HIROSE ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: H01R13/64
- IPC: H01R13/64 ; H01R13/6474 ; H01R13/22 ; H01R43/16

Abstract:
Example implementations described herein are directed to a method and apparatus for improving insertion loss of connector stub and thereby increasing a system's signal bandwidth. This technique shapes the connector stub in a specific way to shift its resonant frequency higher while having equal or better electrical performance below the original resonant frequency.
Public/Granted literature
- US20180261961A1 MITIGATION OF CONNECTOR STUB RESONANCE Public/Granted day:2018-09-13
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