Invention Grant
- Patent Title: Acoustic wave device
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Application No.: US15430849Application Date: 2017-02-13
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Publication No.: US10250219B2Publication Date: 2019-04-02
- Inventor: Kazushige Hatakeyama , Takuma Kuroyanagi
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2016-105001 20160526
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/10 ; H03H9/64 ; H03H9/05

Abstract:
An acoustic wave device includes: a first substrate that includes a first acoustic wave filter located on an upper surface of the first substrate; a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second acoustic wave filter on a lower surface of the second substrate, the lower surface of the second substrate facing the upper surface of the first substrate across an air gap; and a shield electrode that is supported by the upper surface of the first substrate, and is located between at least a part of the first acoustic wave filter and at least a part of the second acoustic wave filter through the air gap.
Public/Granted literature
- US20170346463A1 ACOUSTIC WAVE DEVICE Public/Granted day:2017-11-30
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