Invention Grant
- Patent Title: Acoustic wave device
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Application No.: US15603774Application Date: 2017-05-24
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Publication No.: US10250231B2Publication Date: 2019-04-02
- Inventor: Minako Sakurai , Osamu Kawachi
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2016-113447 20160607
- Main IPC: H03H9/72
- IPC: H03H9/72 ; H01L41/047 ; H01L41/053 ; H01L41/187 ; H03H9/02 ; H03H9/25 ; H03H9/64 ; H03H9/70 ; H03H9/05

Abstract:
An acoustic wave device includes: a support substrate; a first piezoelectric substrate bonded to a first principal surface of the support substrate, the first piezoelectric substrate being a single crystal substrate, a first acoustic wave resonator located on an opposite surface of the first piezoelectric substrate from a surface to which the support substrate is bonded, the first acoustic wave resonator including an IDT; a second piezoelectric substrate bonded to a second principal surface of the support substrate opposite from the first principal surface, the second piezoelectric substrate being a single crystal substrate; and a second acoustic wave resonator located on an opposite surface of the second piezoelectric substrate from a surface to which the support substrate is bonded, the second acoustic wave resonator including an IDT.
Public/Granted literature
- US20170353173A1 ACOUSTIC WAVE DEVICE Public/Granted day:2017-12-07
Information query
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