Component mounter includes a transfer inspection device that inspects the transfer state of solder by imaging the bottom surface of a component, and a transfer inspection data creation device that creates transfer inspection data. The transfer inspection data creation device performs imaging of the bottom surface of a pre-transfer component with a camera at multiple shutter speeds, acquires the multiple pre-transfer images of different shutter speeds, obtains pre-transfer bump portion pixel values, performs imaging of the bottom surface of a post-transfer component with the camera at the same multiple shutter speeds, acquires the multiple post-transfer images of different shutter speeds, obtains post-transfer bump portion pixel values, and determines the shutter speed to be used when performing transfer inspection based on the post-transfer bump portion pixel values. Transfer inspection data is created based on the pre- and post-transfer bump portion pixel values of images captured at the determined shutter speed.