Invention Grant
- Patent Title: Circuit structure
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Application No.: US16061349Application Date: 2017-01-25
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Publication No.: US10251261B2Publication Date: 2019-04-02
- Inventor: Tou Chin , Arinobu Nakamura
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka
- Agency: Honigman LLP
- Priority: JP2016-013689 20160127
- International Application: PCT/JP2017/002580 WO 20170125
- International Announcement: WO2017/131044 WO 20170803
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; B60R16/02 ; H05K1/18

Abstract:
A circuit structure includes a circuit substrate surface having a circuit pattern; a plurality of bus bars are fixed to another surface of the circuit substrate with an interval therebetween; an electronic component straddles an interval between two adjacent bus bars, a first terminal is electrically connected to one bus bar and a second terminal is electrically connected to the circuit pattern; and a flexible sheet member is fixed to the bus bar to insulate the bus bar and the second terminal from each other, while electrically connecting the second terminal and the circuit pattern. The flexible sheet member includes: an adhesive layer fixed to the bus bar; a terminal conductor foil piece electrically connecting the second terminal and the circuit pattern; and an insulating layer that is interposed between the adhesive layer and the terminal conductor foil piece insulating the bus bar and the terminal conductor foil piece.
Public/Granted literature
- US20180368249A1 CIRCUIT STRUCTURE Public/Granted day:2018-12-20
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