Invention Grant
- Patent Title: Circuit structure
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Application No.: US15545092Application Date: 2016-01-13
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Publication No.: US10251268B2Publication Date: 2019-04-02
- Inventor: Arinobu Nakamura , Tou Chin
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka
- Agency: Honigman LLP
- Priority: JP2015-019386 20150203
- International Application: PCT/JP2016/050752 WO 20160113
- International Announcement: WO2016/125544 WO 20160811
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/18

Abstract:
A circuit structure is provided to which an electronic component can be easily mounted (electrical connection of terminals). A circuit structure that includes a substrate provided with a conductive pattern on one face, a conductive member fixed to another face of the substrate, and an electronic component that has first terminals and, which are a portion of a plurality of terminals, electrically connected to the conductive member, and a terminal, which is a portion of the plurality of terminals, electrically connected to the conductive pattern provided on the substrate, wherein the conductive member has a shape in which at least a portion of the second terminal of the electronic component is not overlapped.
Public/Granted literature
- US20180020542A1 CIRCUIT STRUCTURE Public/Granted day:2018-01-18
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