Invention Grant
- Patent Title: Printed circuit board and a method for producing a printed circuit board
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Application No.: US15797542Application Date: 2017-10-30
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Publication No.: US10251276B2Publication Date: 2019-04-02
- Inventor: Johannes Bock , Thomas Schmidt , Bernhard Schuch
- Applicant: Conti Temic microelectronic GmbH
- Applicant Address: DE Nürnberg
- Assignee: Conti Temic microelectronic GmbH
- Current Assignee: Conti Temic microelectronic GmbH
- Current Assignee Address: DE Nürnberg
- Priority: DE102015208523 20150507
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02 ; H05K1/14 ; H05K3/36 ; H05K3/00 ; H05K3/28 ; H05K3/30 ; H05K5/00

Abstract:
The disclosure relates to a printed circuit board for an electronic component. The printed circuit board includes: an electrically insulating substrate; a number of electrically conductive conductor tracks; and at least one sensor dome having a sensor head and having a carrier body for accommodating the sensor head. The carrier body is formed integrally with the substrate. The disclosure also relates to a method for producing the printed circuit board.
Public/Granted literature
- US20180070450A1 PRINTED CIRCUIT BOARD AND A METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD Public/Granted day:2018-03-08
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