There is provided a device for cooling a component, including a support configured to receive a component to be cooled, the support including a fluid network configured for liquid circulation therein, the network including a first cavity, a second cavity, and a first channel connecting the first cavity to the second cavity, a first deformable membrane and a second deformable membrane configured to form a mobile wall of the first cavity and a mobile wall of the second cavity respectively, the device further including an actuating device configured to actuate the first membrane and the second membrane, and a thermal conducting element close to the channel or in contact with the channel.