Invention Grant
- Patent Title: Heat radiation apparatus using modular cooling apparatus
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Application No.: US15695040Application Date: 2017-09-05
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Publication No.: US10251319B2Publication Date: 2019-04-02
- Inventor: Soo-Yong Hwang
- Applicant: LSIS CO., LTD.
- Applicant Address: KR Anyang-si, Gyeonggi-Do
- Assignee: LSIS CO., LTD.
- Current Assignee: LSIS CO., LTD.
- Current Assignee Address: KR Anyang-si, Gyeonggi-Do
- Agency: K&L Gates LLP
- Priority: KR20-2017-0000907U 20170223
- Main IPC: H01L23/467
- IPC: H01L23/467 ; H02M7/00 ; H05K7/14 ; H05K7/20 ; H01L23/40 ; H01L23/367
Abstract:
Disclosed herein is a heat radiation apparatus using modular cooling apparatuses. The heat radiation apparatus includes one or more modular apparatuses, and a housing in which the modular apparatuses are inserted. The housing includes an outer frame, and one or more bridges that support the modular cooling apparatuses in the outer frame. A step is formed at the outer frame and the bridges to mount a radiation plate thereon.
Public/Granted literature
- US20180242474A1 HEAT RADIATION APPARATUS USING MODULAR COOLING APPARATUS Public/Granted day:2018-08-23
Information query
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