A die including a first support having a plurality of panels with adjacent ones of the panels defining a gap therebetween, and a second support having a plurality of panels with adjacent ones of the panels defining a gap therebetween. The first and second supports are configured to be interleaved by positioning at least one panel of each support within one of the gaps of the other support. The first and second supports are positionable in an interleaved configuration in a plurality of different positions relative to each other. The die further includes a coupling component configured to engage at least one of the supports to couple the at least one support to an underlying surface when the first and second supports are in one of the plurality of different positions.