Provided are methods for heat curing of various materials, such as heat curable materials or more specifically potting compounds, which are disposed within cavities with limited access to these materials. Also provided are curing for executing such methods. In some embodiments, a heat curable material disposed within a cavity may be heated by a heating rod protruding into the cavity or through the cavity. The heating rod is thermally coupled to the heat curable material and is used to transfer heat to the heat curable material. For example, the heating rod may include a resistive heating element. The heating element may be positioned in such a way that the heat curable material is selectively heated within the cavity without significant heating of surrounding components. In some embodiments, the heating rod may be also used to compress the part containing the cavity or a stack including this part.