Invention Grant
- Patent Title: Process for forming transfer film
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Application No.: US15092324Application Date: 2016-04-06
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Publication No.: US10252499B2Publication Date: 2019-04-09
- Inventor: Eiichi Takahashi , Nobuhiro Koga , Yasuyuki Imaizumi
- Applicant: Eiichi Takahashi , Nobuhiro Koga , Yasuyuki Imaizumi
- Applicant Address: JP Tokyo
- Assignee: YOSHINO KOGYOSHO CO., LTD.
- Current Assignee: YOSHINO KOGYOSHO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2005-102325 20050331
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B7/12 ; B32B27/34 ; B32B27/32 ; B32B27/36 ; B32B7/06 ; B44C1/17 ; B65D35/08 ; B32B37/14 ; B32B37/00 ; B32B37/06 ; B32B37/10

Abstract:
A process includes forming a transfer film without a release layer in which the transfer film includes a substrate layer to be peeled off during a transfer process, and a transfer layer to be transferred to an article to be decorated. The transfer layer has a protective layer, a printed or vapor-deposited decorative layer, and an adhering layer, which are laminated in this order. The substrate layer is a base film of a synthetic resin formed by extruding a molten synthetic resin. The substrate layer is so laminated and thermally compressed in direct contact with the protective layer such that the substrate layer does not peel off the protective layer before the transfer process and peels off the protective layer from a peeled end portion of the substrate layer as a trigger during the transfer process, by thermally pressing the substrate layer and the protective layer between rolls.
Public/Granted literature
- US20160214362A1 PROCESS FOR FORMING TRANSFER FILM Public/Granted day:2016-07-28
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