Invention Grant
- Patent Title: Multiple layer interlayer resisting defect formation
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Application No.: US14505191Application Date: 2014-10-02
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Publication No.: US10252500B2Publication Date: 2019-04-09
- Inventor: Jun Lu
- Applicant: Solutia Inc.
- Applicant Address: US MO St. Louis
- Assignee: Solutia Inc.
- Current Assignee: Solutia Inc.
- Current Assignee Address: US MO St. Louis
- Agent Michelle Bugbee
- Main IPC: B32B27/30
- IPC: B32B27/30 ; B32B7/02 ; B32B27/08 ; B32B27/02 ; B32B27/22 ; B32B27/36 ; B32B27/42 ; B32B17/10

Abstract:
Multilayered interlayers comprising stiff skin or outer layers and a soft core layer(s) are disclosed. The multilayered interlayers comprise: a first polymer layer (skin layer) comprising plasticized poly(vinyl butyral) resin; a second polymer layer (core layer) comprising a blend of two (or more) plasticized poly(vinyl butyral) resins having different residual hydroxyl content; and optionally a third polymer layer (skin layer) comprising plasticized poly(vinyl butyral) resin.
Public/Granted literature
- US20160096349A1 MULTIPLE LAYER INTERLAYER RESISTING DEFECT FORMATION Public/Granted day:2016-04-07
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