Invention Grant
- Patent Title: Package for MEMS device and process
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Application No.: US15788499Application Date: 2017-10-19
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Publication No.: US10252906B2Publication Date: 2019-04-09
- Inventor: Roberto Brioschi , David Patten , Rkia Achehboune
- Applicant: Cirrus Logic International Semiconductor Ltd.
- Applicant Address: US TX Austin
- Assignee: Cirrus Logic, Inc.
- Current Assignee: Cirrus Logic, Inc.
- Current Assignee Address: US TX Austin
- Agency: Jackson Walker L.L.P.
- Priority: GB1620434.9 20161201
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00 ; B81B3/00
Abstract:
The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.
Public/Granted literature
- US20180127265A1 PACKAGE FOR MEMS DEVICE AND PROCESS Public/Granted day:2018-05-10
Information query
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