Invention Grant
- Patent Title: Glass composition, glass frit containing same, glass paste containing same, and electrical/electronic component obtained using same
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Application No.: US14129483Application Date: 2012-06-25
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Publication No.: US10252938B2Publication Date: 2019-04-09
- Inventor: Yuichi Sawai , Takashi Naito , Takuya Aoyagi , Tadashi Fujieda
- Applicant: Yuichi Sawai , Takashi Naito , Takuya Aoyagi , Tadashi Fujieda
- Applicant Address: JP Tokyo
- Assignee: HITACHI, LTD.
- Current Assignee: HITACHI, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2011-147950 20110704; JP2011-213739 20110929
- International Application: PCT/JP2012/066161 WO 20120625
- International Announcement: WO2013/005600 WO 20130110
- Main IPC: C03C8/14
- IPC: C03C8/14 ; C03C8/24 ; H01B1/16 ; C03C8/20 ; H01J29/90 ; H01J11/48 ; C03C3/12 ; C03C3/16 ; C03C8/02 ; C03C8/08 ; C03C8/16
Abstract:
The present invention aims at providing a lead-free glass composition that can be soften and flowed at a firing temperature that is equal to or lower than that of conventional low melting point lead glass. Furthermore, the present invention aims at providing a lead-free glass composition having fine thermal stability and fine chemical stability in addition to that property. The lead-free glass composition according to the present invention is characterized by comprising at least Ag2O, V2O5 and TeO2 when the components are represented by oxides, wherein the total content ratio of Ag2O, V2O5 and TeO2 is 75 mass % or more. Preferably, the lead-free glass composition comprises 10 to 60 mass % of Ag2O, 5 to 65 mass % of V2O5, and 15 to 50 mass % of TeO2.
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