Invention Grant
- Patent Title: Shape memory thermal interface materials
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Application No.: US15833689Application Date: 2017-12-06
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Publication No.: US10253157B2Publication Date: 2019-04-09
- Inventor: Joseph Kuczynski , Kevin M. O'Connell , Chelsie M. Peterson , Mark D. Plucinski , Timothy J. Tofil
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jared L. Montanaro
- Main IPC: C08K3/22
- IPC: C08K3/22 ; H01L23/373 ; C09K5/14 ; C08K7/06
Abstract:
Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.
Public/Granted literature
- US20180094113A1 SHAPE MEMORY THERMAL INTERFACE MATERIALS Public/Granted day:2018-04-05
Information query
