Invention Grant
- Patent Title: Semi-aromatic polyamide resin composition and molded article of same
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Application No.: US15104626Application Date: 2014-12-19
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Publication No.: US10253182B2Publication Date: 2019-04-09
- Inventor: Kaoru Minagawa , Hiroki Ebata , Isao Washio , Kouichi Sano , Nobuhiro Takizawa , Akinori Amano
- Applicant: MITSUI CHEMICALS, INC.
- Applicant Address: JP Minato-Ku, Tokyo
- Assignee: MITSUI CHEMICALS, INC.
- Current Assignee: MITSUI CHEMICALS, INC.
- Current Assignee Address: JP Minato-Ku, Tokyo
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2013-264388 20131220
- International Application: PCT/JP2014/006356 WO 20141219
- International Announcement: WO2015/093060 WO 20150625
- Main IPC: C08L77/06
- IPC: C08L77/06 ; C08G69/26 ; C08K7/14 ; C08L51/06

Abstract:
The problem of the invention is to provide a semi-aromatic polyamide resin composition having high rigidity, exceptional impact resistance, and exceptional zygosity with very little change in hardness associated with heating and cooling, as well as a molded article of this semi-aromatic polyamide resin composition. A semi-aromatic polyamide resin composition containing a semi-aromatic polyamide resin (A), acid-modified polyolefin resin (B), and fibrous filler (C), wherein the resin (A) contains a certain amount or more of terephthalic acid component units relative to the total number of moles of dicarboxylic acid component units, the semi-aromatic polyamide resin composition contains a certain amount or more of the resin (B), the glass transition temperature of the semi-aromatic polyamide resin composition is within a predetermined range, and the Vicat softening point of the resin (B) is within a predetermined range, is used as the semi-aromatic polyamide resin composition in order to solve this problem.
Public/Granted literature
- US20160312027A1 SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME Public/Granted day:2016-10-27
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