Invention Grant
- Patent Title: Additives for barrier chemical mechanical planarization
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Application No.: US15630584Application Date: 2017-06-22
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Publication No.: US10253216B2Publication Date: 2019-04-09
- Inventor: Matthias Stender , Maitland Gary Graham , Dnyanesh Chandrakant Tamboli , Xiaobo Shi
- Applicant: Versum Materials US, LLC
- Applicant Address: US AZ Tempe
- Assignee: VERSUM MATERIALS US, LLC
- Current Assignee: VERSUM MATERIALS US, LLC
- Current Assignee Address: US AZ Tempe
- Agent Lina Yang
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/04 ; C09K3/14 ; H01L21/321 ; H01L21/768 ; C09G1/00
Abstract:
A barrier chemical mechanical planarization polishing composition is provided that includes suitable chemical additives. The suitable chemical additives are silicate compound and high molecular weight polymers/copolymers. There is also provided a chemical mechanical polishing method using the barrier chemical mechanical planarization polishing composition.
Public/Granted literature
- US20180002571A1 Additives for Barrier Chemical Mechanical Planarization Public/Granted day:2018-01-04
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