Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same using an adhesive
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Application No.: US15752666Application Date: 2017-03-31
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Publication No.: US10253223B2Publication Date: 2019-04-09
- Inventor: Jung Hak Kim , Hee Jung Kim , Se Ra Kim , Kwang Joo Lee , Seung Hee Nam , Young Kook Kim
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR10-2016-0039249 20160331; KR10-2017-0041414 20170331
- International Application: PCT/KR2017/003578 WO 20170331
- International Announcement: WO2017/171492 WO 20171005
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; C09J133/10 ; C09J163/04 ; H01L21/56 ; H01L25/065 ; H01L23/31 ; C08G59/62 ; C09J163/00
Abstract:
The present invention relates to a semiconductor device including: a first semiconductor element fixed onto an adherend by flip-chip connection; an adhesive layer for embedding a space between the adherend and the first semiconductor element and embedding the first semiconductor element; and a second semiconductor element connected to the first semiconductor element via the adhesive layer, wherein the adhesive layer has a predetermined melt viscosity and thixotropic index.
Public/Granted literature
- US20180237667A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-08-23
Information query
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