Invention Grant
- Patent Title: Compound, thin film-forming material, and thin film manufacturing method
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Application No.: US15559127Application Date: 2016-05-17
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Publication No.: US10253408B2Publication Date: 2019-04-09
- Inventor: Tomoharu Yoshino , Masaki Enzu , Akihiro Nishida , Nana Sugiura
- Applicant: ADEKA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADEKA CORPORATION
- Current Assignee: ADEKA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2015-121840 20150617
- International Application: PCT/JP2016/064573 WO 20160517
- International Announcement: WO2016/203887 WO 20161222
- Main IPC: C07F13/00
- IPC: C07F13/00 ; C07F15/04 ; C07F15/06 ; C23C16/18 ; H01L21/285
Abstract:
A novel compound represented by the general formula (I) or (II) below: [in the formula, each of R1 and R2 independently represent a C1˜12 hydrocarbon group, and Si(R3)3 is optionally substituted for a hydrogen atom in the hydrocarbon group; however, R1 and R2 are different groups; R3 represents a methyl or ethyl group; M represents a metal atom or silicon atom; and n is an integer from 1 to 4].
Public/Granted literature
- US20180051372A1 NOVEL COMPOUND, THIN FILM-FORMING MATERIAL, AND THIN FILM MANUFACTURING METHOD Public/Granted day:2018-02-22
Information query
