- Patent Title: Techniques to reduce light bleed for electronic device assemblies
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Application No.: US14940038Application Date: 2015-11-12
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Publication No.: US10253946B2Publication Date: 2019-04-09
- Inventor: Seth Spiel , Matthew Cho
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Polsinelli PC
- Main IPC: F21V3/06
- IPC: F21V3/06 ; H05K5/00

Abstract:
Techniques to reduce light dissipation (e.g., light bleed) for electronic device assemblies. According to one embodiment, the techniques include forming a housing for a device from a plastic material. The housing defines an area of permissible light transmission from an interior portion of the housing through an exterior portion of the housing to provide one or more visual notifications for the device. The techniques further include forming a light dissipation layer from the plastic material proximate the area of permissible light transmission to inhibit light propagation through the housing outside the area of permissible light transmission.
Public/Granted literature
- US20170138573A1 TECHNIQUES TO REDUCE LIGHT BLEED FOR ELECTRONIC DEVICE ASSEMBLIES Public/Granted day:2017-05-18
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