Techniques to reduce light bleed for electronic device assemblies
Abstract:
Techniques to reduce light dissipation (e.g., light bleed) for electronic device assemblies. According to one embodiment, the techniques include forming a housing for a device from a plastic material. The housing defines an area of permissible light transmission from an interior portion of the housing through an exterior portion of the housing to provide one or more visual notifications for the device. The techniques further include forming a light dissipation layer from the plastic material proximate the area of permissible light transmission to inhibit light propagation through the housing outside the area of permissible light transmission.
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