Invention Grant
- Patent Title: Enclosure surface temperature estimation method and electronic apparatus
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Application No.: US14939047Application Date: 2015-11-12
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Publication No.: US10254179B2Publication Date: 2019-04-09
- Inventor: Masatoshi Ishii , Yoshiyasu Nakashima
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2014-262672 20141225; JP2015-154015 20150804
- Main IPC: G01N25/18
- IPC: G01N25/18 ; G01K7/42

Abstract:
A processor disposed over a substrate of an electronic apparatus acquires a first measured value from a temperature sensor disposed on the substrate, and calculates surface temperature of a surface of an enclosure of the electronic apparatus on the basis of a transfer function G(s) based on a first thermal resistance and a first thermal capacitance between a heat source over the substrate and the surface of the enclosure, a transfer function H(s) based on a second thermal resistance and a second thermal capacitance between the heat source and the temperature sensor, and the first measured value.
Public/Granted literature
- US20160187272A1 ENCLOSURE SURFACE TEMPERATURE ESTIMATION METHOD AND ELECTRONIC APPARATUS Public/Granted day:2016-06-30
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