Invention Grant
- Patent Title: Liquid solder resist composition and printed wiring board
-
Application No.: US15569051Application Date: 2016-10-12
-
Publication No.: US10254647B2Publication Date: 2019-04-09
- Inventor: Yoshio Sakai
- Applicant: GOO CHEMICAL CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: GOO CHEMICAL CO., LTD.
- Current Assignee: GOO CHEMICAL CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Cheng Law Group, PLLC
- Priority: JP2016-052473 20160316
- International Application: PCT/JP2016/004551 WO 20161012
- International Announcement: WO2017/158660 WO 20170921
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/28 ; G03F7/004 ; G03F7/029 ; G03F7/031 ; G03F7/033 ; G03F7/038
Abstract:
A liquid solder resist composition contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), and a photopolymerization initiator (D). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1).
Public/Granted literature
- US20180136559A1 LIQUID SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD Public/Granted day:2018-05-17
Information query
