Invention Grant
- Patent Title: Radiation-sensitive resin composition, resin film, and electronic device
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Application No.: US14913468Application Date: 2014-08-25
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Publication No.: US10254648B2Publication Date: 2019-04-09
- Inventor: Hiroaki Shindo
- Applicant: ZEON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ZEON CORPORTION
- Current Assignee: ZEON CORPORTION
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2013-175460 20130827
- International Application: PCT/JP2014/072110 WO 20140825
- International Announcement: WO2015/029930 WO 20150305
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/50 ; C08G61/04 ; G03F7/037 ; G03F7/023 ; G03F7/027 ; G03F7/032 ; G03F7/033 ; G03F7/075 ; G06F3/041
Abstract:
A radiation-sensitive resin composition comprising a binder resin (A), quinone diazide-based photoacid generator (B), (meth)acrylate compound (C), and photopolymerization initiator (D) is provided. According to the present invention, it is possible to provide a radiation-sensitive resin composition which can give a resin film which exhibits a high adhesion to a substrate and is excellent in transparency, photosensitivity, and chemical resistance.
Public/Granted literature
- US20160209744A1 RADIATION-SENSITIVE RESIN COMPOSITION, RESIN FILM, AND ELECTRONIC DEVICE Public/Granted day:2016-07-21
Information query
