Invention Grant
- Patent Title: Silicon wafer transportation system
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Application No.: US15576070Application Date: 2016-05-20
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Publication No.: US10254661B2Publication Date: 2019-04-09
- Inventor: Kai Liu , Songli Hu , Jie Jiang
- Applicant: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Current Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201510270081 20150524
- International Application: PCT/CN2016/082790 WO 20160520
- International Announcement: WO2016/188371 WO 20161201
- Main IPC: G03B27/42
- IPC: G03B27/42 ; G03B27/58 ; G03F7/20 ; G03F9/00 ; B25J9/00 ; B25J9/04 ; B25J11/00 ; B25J15/00 ; B25J15/06 ; H01L21/677 ; H01L21/687

Abstract:
A wafer transfer system for use in a photolithography system including a wafer storage apparatus, a pre-alignment apparatus, a buffer stage and a wafer stage is disclosed, which includes: a dual-arm robot, configured to take a wafer to be exposed from the wafer storage apparatus and transfer it onto the pre-alignment apparatus and further configured to remove an exposed wafer from the buffer stage and place it back into the wafer storage apparatus; a wafer-loading linear robot, configured to transfer a pre-aligned wafer onto the wafer stage; and a wafer-unloading linear robot, configured to transfer the exposed wafer onto the buffer stage. The dual-arm robot, the wafer-loading linear robot and the wafer-unloading linear robot can operate in parallel so as to achieve time savings in the wafer transfers.
Public/Granted literature
- US20180143541A1 SILICON WAFER TRANSPORTATION SYSTEM Public/Granted day:2018-05-24
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