Invention Grant
- Patent Title: Electrically conductive overlay for head-medium contact sensor
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Application No.: US15484261Application Date: 2017-04-11
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Publication No.: US10255937B1Publication Date: 2019-04-09
- Inventor: Gary Joseph Kunkel , Jin Fang , Erik J. Hutchinson
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: Hollingsworth Davis, LLC
- Main IPC: G11B5/60
- IPC: G11B5/60 ; G11B5/48 ; G11B5/00

Abstract:
A contact sensor is provided at or near an air bearing surface of a slider and having a temperature coefficient of resistance. The contact sensor is coupled to a lead arrangement comprising a first lead and a second lead. The contact sensor comprises a sensor element, a first peripheral wing comprising an inner wing connected to the sensor element and an outer wing connected to the first lead, and a second peripheral wing comprising an inner wing connected to the sensor element and an outer wing connected to the second lead. An electrically conductive overlay covers at least the outer wings of the first and second peripheral wings and some or all of the first and second electrical leads.
Information query
IPC分类: