Invention Grant
- Patent Title: Method of manufacturing multilayer ceramic electronic component
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Application No.: US15401625Application Date: 2017-01-09
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Publication No.: US10256044B2Publication Date: 2019-04-09
- Inventor: Bong Jun Juhng , Doo Young Kim , Ki Pyo Hong , You Na Kim , Hye Young Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Morgan Lewis & Bockius LLP
- Priority: KR10-2016-0047754 20160419
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/248 ; H01G13/00 ; H01G4/232 ; H01G4/012 ; H01G4/12
Abstract:
A method of manufacturing a multilayer ceramic electronic component includes forming external electrodes on end surfaces of a ceramic body, and more particularly, to forming external electrodes by attaching a sheet for forming an external electrode on a ceramic body. A multilayer ceramic electronic component thus formed has external electrodes with a thin and uniform thickness.
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