An electrostatic chuck heater includes a disc-shaped ceramic base and a plurality of heating elements embedded in the ceramic base. A top surface of the electrostatic chuck heater, which serves as a wafer mounting surface, is divided into multiple zones. The heating elements, which each include terminals that are embedded in the ceramic base in the respective zones. Terminal collection regions are provided on a bottom surface of the electrostatic chuck heater. The number of terminal collection regions is smaller than the total number of heating elements. The terminals of each of the heating elements are connected to one of the terminal collection regions through the ceramic base.