Invention Grant
- Patent Title: Replacement contacts
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Application No.: US15461216Application Date: 2017-03-16
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Publication No.: US10256143B2Publication Date: 2019-04-09
- Inventor: Yee-Chia Yeo , Teng-Chun Tsai , Yasutoshi Okuno
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/768 ; H01L23/522 ; H01L21/308 ; H01L21/3065 ; H01L21/306

Abstract:
The present disclosure describes a method of forming a replacement contact. For example, the replacement contact can include a metal with one or more first sidewall surfaces and a top surface. A first dielectric can be formed to abut the one or more first sidewall surfaces of the metal. A second dielectric can be formed over the first dielectric and the top surface of the metal. An opening in the second dielectric can be formed. A metal oxide structure can be selectively grown on the top surface of the metal, where the metal oxide structure has one or more second sidewall surfaces. One or more spacers can be formed to abut the one or more second sidewall surfaces of the metal oxide structure. Further, the metal oxide structure can be removed.
Public/Granted literature
- US20180166379A1 REPLACEMENT CONTACTS Public/Granted day:2018-06-14
Information query
IPC分类: