Invention Grant
- Patent Title: Solid-state imaging element, imaging device, and electronic apparatus
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Application No.: US15554314Application Date: 2016-02-26
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Publication No.: US10256269B2Publication Date: 2019-04-09
- Inventor: Takuro Murase , Hirotoshi Nomura
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2015-049720 20150312
- International Application: PCT/JP2016/055794 WO 20160226
- International Announcement: WO2016/143554 WO 20160915
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L27/146 ; G01C3/06 ; G02B7/34 ; H01L27/14 ; H04N5/374

Abstract:
The present technology relates to a solid-state imaging element, an imaging device, and an electronic apparatus which enable enhancement of focusing accuracy and sensitivity and suppression of color mixing, in a high image height portion. Incident light is condensed by a main lens, and the condensed light is condensed by a plurality of on-chip lenses. The on-chip lenses are each shared by a plurality of photodiodes that receive the light condensed by the on-chip lens and that generate and accumulate electric charges corresponding to the amounts of light. The plurality of photodiodes sharing the on-chip lens are shaped, in accordance with the image height of the on-chip lens, in such a manner as to have substantially uniform light reception characteristics. The present technology is applicable to a CMOS image sensor.
Public/Granted literature
- US20180047775A1 SOLID-STATE IMAGING ELEMENT, IMAGING DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2018-02-15
Information query
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