Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US15800870Application Date: 2017-11-01
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Publication No.: US10256338B2Publication Date: 2019-04-09
- Inventor: Takeharu Koga
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: JP2016-235388 20161202
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/04 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/16 ; H01L29/36 ; H01L29/66 ; H01L29/78 ; H01L21/027 ; H01L29/167 ; H01L29/423 ; H01L29/739

Abstract:
A semiconductor device includes a semiconductor substrate, a first epitaxial layer of a first conductivity type, a first semiconductor region of the first conductivity type, a second epitaxial layer of a second conductivity type, a second semiconductor region of the first conductivity type, a gate insulating film, a gate electrode, an interlayer insulating film, a source electrode; and a gate electrode pad. The first semiconductor region is not provided beneath the gate electrode pad.
Public/Granted literature
- US20180158946A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2018-06-07
Information query
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