Invention Grant
- Patent Title: Bus supports and related assemblies and methods
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Application No.: US15290745Application Date: 2016-10-11
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Publication No.: US10256615B2Publication Date: 2019-04-09
- Inventor: Sachidanandan Murugiah
- Applicant: Tyco Electronics Canada ULC
- Applicant Address: CA Markham, Ontario
- Assignee: Tyco Electronics Canada ULC
- Current Assignee: Tyco Electronics Canada ULC
- Current Assignee Address: CA Markham, Ontario
- Agency: Myers Bigel, P.A.
- Main IPC: H02G5/02
- IPC: H02G5/02 ; H01B17/16 ; H01B17/44

Abstract:
A bus support includes a corona shield portion and a bus support portion on the corona shield portion. The bus support portion includes an insulator engagement ledge including one or more mounting apertures configured to receive a fastener therethrough for mounting the bus support to an insulator. The bus support portion includes first and second bus support walls extending upwardly from opposite sides of the insulator engagement ledge. Each bus support wall includes a U-shaped channel defined therein that is configured to receive and support a cylindrical and/or tubular bus conductor. The corona shield portion and the bus support portion form a monolithic structure.
Public/Granted literature
- US20170110865A1 BUS SUPPORTS AND RELATED ASSEMBLIES AND METHODS Public/Granted day:2017-04-20
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