Invention Grant
- Patent Title: Method and apparatus for supplying power
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Application No.: US15468277Application Date: 2017-03-24
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Publication No.: US10256644B2Publication Date: 2019-04-09
- Inventor: Taesin Ha , Youngbo Shim , Hyun Do Choi , Kyung-Rock Kim , Jeonghun Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0140267 20161026
- Main IPC: H02J7/00
- IPC: H02J7/00 ; H01L43/04

Abstract:
A method and apparatus for supplying a power to a hardware module when the hardware module is mounted are provided. The method and apparatus may supply a power to a hardware module when both a mounting signal indicating that the hardware module is mounted in a module circuit and a trigger signal input by a user are received.
Public/Granted literature
- US20180115172A1 METHOD AND APPARATUS FOR SUPPLYING POWER Public/Granted day:2018-04-26
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