The present disclosure relates to a solid-state image pickup element, an image pickup module and electronic equipment configured to avoid large scaling of an image pickup element caused by an improvement in functions thereof. The solid-state image pickup element is configured with a lamination of an image sensor substrate on which a plurality of pixels is arranged on a surface of a sensor, and a signal processing substrate in which signal processing of an image signal output from the image sensor substrate is executed. The signal processing substrate has an electronic blur correction processing unit, a first connection unit that connects with an optical blur correction processing unit, and a second connection unit that connects with a gyro sensor which detects a blur generated in an image. At least a part of signals passed between the gyro sensor and the optical blur correction processing unit passes through the signal processing substrate.