Invention Grant
- Patent Title: Optical module
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Application No.: US15857855Application Date: 2017-12-29
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Publication No.: US10257910B2Publication Date: 2019-04-09
- Inventor: Long Zheng
- Applicant: Hisense Broadband Multimedia Technologies Co., Ltd. , Hisense Broadband Multimedia Technologies, Ltd.
- Applicant Address: CN Qingdao, Shandong VG Tortola
- Assignee: Hisense Broadband Multimedia Technologies Co., Ltd.,Hisense Broadband Multimedia Technologies, Ltd.
- Current Assignee: Hisense Broadband Multimedia Technologies Co., Ltd.,Hisense Broadband Multimedia Technologies, Ltd.
- Current Assignee Address: CN Qingdao, Shandong VG Tortola
- Agency: Brinks Gilson & Lione
- Priority: CN201710220900 20170406; CN201710365787 20170517; CN201710370658 20170523; CN201710592117 20170719; CN201710706221 20170817; CN201710725586 20170822; CN201710842912 20170918; CN201710934006 20171010
- Main IPC: H04K3/00
- IPC: H04K3/00 ; H05B37/02 ; F21V29/504 ; F21V29/508 ; F21V29/83 ; F21V5/04 ; F21V23/00 ; G02B6/42 ; H05K9/00 ; H04B10/40 ; H04B10/50 ; H04B10/85 ; H04B15/02

Abstract:
The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.
Public/Granted literature
- US20180294885A1 OPTICAL MODULE Public/Granted day:2018-10-11
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