Invention Grant
- Patent Title: Method for reducing conductor track spacing in electronic circuit boards and electronic circuit board with reduced spacing between conductor tracks
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Application No.: US15773205Application Date: 2016-10-19
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Publication No.: US10257922B2Publication Date: 2019-04-09
- Inventor: Peter Hummel , Stefan Mannhardt
- Applicant: OSRAM GmbH
- Applicant Address: DE Munich
- Assignee: OSRAM GMBH
- Current Assignee: OSRAM GMBH
- Current Assignee Address: DE Munich
- Agency: Viering, Jentschura & Partner MBB
- Priority: DE102015221688 20151105
- International Application: PCT/EP2016/075049 WO 20161019
- International Announcement: WO2017/076641 WO 20170511
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H02H9/04 ; H05K1/02 ; F21Y115/10 ; F21V23/02

Abstract:
A method for reducing conductor track spacings in a printed circuit board, wherein the printed circuit board has an input part, wherein the input part is fed by a supply voltage, and has an output part, comprising the following steps: inserting an intermediate conductor track which has an intermediate potential derived from the input part, maintaining a functional insulation gap between the intermediate conductor track and adjacent conductor tracks of the input part, maintaining a safety-relevant insulation gap between the intermediate conductor track and the adjacent conductor tracks of the output part. The intermediate potential has, with respect to adjacent conductor tracks of the output part, a voltage which corresponds at most to the supply voltage of the input part.
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