Systems and methods for grooved vias are described. For example, a method may include: drilling a via hole in a Printed Circuit Board (PCB), where the PCB comprises a first layer having a first trace and a second layer having a second trace, the via hole includes a first portion between the first layer and the second layer and a second portion between the second layer and a bottom surface of the PCB, and the via hole is configured to couple the first trace to the second trace through the first portion; after drilling the via hole, creating a rough internal surface in at least the second portion of the via hole that is configured to reduce a resonance of a signal transmitted from the first trace to the second trace; and forming a via by filling the first and second portions of the via hole with conductive material.