A printed circuit board assembly (1) and a method for manufacturing a printed circuit board assembly (1) are provided. The method comprises: providing a substrate (2), printing a circuit pattern on the substrate (2) thereby forming a bottom layer (4a) of an uncured conductive material (7) and a top layer (4b) of an insulating material (8), arranging at least one electronic component (5), having at least one electrical connection part (6), on the top layer (4b) of the circuit pattern, the at least one electrical connection part (6) of the at least one electronic component (5) forming at least one electrical connection (9) with the bottom layer (4a) comprising the uncured conductive material (7), and, after arranging said at least one electronic component (5) on the top layer (4b), curing the conductive material (7) and the insulating material (8). By this method, the conductive material (7) mechanically secures said at least one electronic component (5) to the substrate (2).