Invention Grant
- Patent Title: Chip resistor, method of producing chip resisitor and chip resistor packaging structure
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Application No.: US15276490Application Date: 2016-09-26
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Publication No.: US10257936B2Publication Date: 2019-04-09
- Inventor: Kentaro Naka
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2011-110236 20110517
- Main IPC: H01C1/01
- IPC: H01C1/01 ; H05K1/18 ; H01C17/00 ; H01C17/28 ; H01C1/14

Abstract:
[Object] A method for efficiently manufacturing chip resistors is provided.[Means]The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.
Public/Granted literature
- US20170013719A1 CHIP RESISTOR, METHOD OF PRODUCING CHIP RESISITOR AND CHIP RESISTOR PACKAGING STRUCTURE Public/Granted day:2017-01-12
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