- Patent Title: Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
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Application No.: US14907486Application Date: 2014-07-24
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Publication No.: US10257938B2Publication Date: 2019-04-09
- Inventor: Michiya Kohiki
- Applicant: JX NIPPON MINING & METALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2013-153732 20130724; JP2013-153765 20130724
- International Application: PCT/JP2014/069624 WO 20140724
- International Announcement: WO2015/012376 WO 20150129
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/38 ; H05K3/20 ; B32B15/08 ; C25D7/06 ; C23C18/16 ; B32B15/20 ; B32B27/20 ; C25D5/10 ; H05K1/09 ; C25D1/04 ; C25D3/38 ; C25D3/58
Abstract:
The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil, wherein a surface-treated layer is formed on a copper foil, and the proportion of the area corresponding to the particles of the surface of the surface-treated layer is 0.1 to 0.85.
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