Invention Grant
- Patent Title: Grounding structure formed of resin material
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Application No.: US15874464Application Date: 2018-01-18
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Publication No.: US10259409B2Publication Date: 2019-04-16
- Inventor: Sho Endoh
- Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Applicant Address: JP Toyota-shi
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota-shi
- Agency: Hunton Andrews Kurth LLP
- Priority: JP2017-023341 20170210
- Main IPC: B60R16/06
- IPC: B60R16/06 ; B60R16/02 ; H01R13/6596 ; H01B1/22 ; H01B5/14 ; H01B17/62 ; H01B3/30

Abstract:
A grounding structure for a vehicle provided with a floor portion formed of a resin material includes a sheet-shaped wiring sheet including a conductive material for electrical connection between an electric power supply and an electronic component and a sheet-shaped conductive portion electrically connected to a grounding potential. The conductive portion includes a part disposed to overlap a surface of the wiring sheet on an outer portion side of the vehicle.
Public/Granted literature
- US20180229678A1 GROUNDING STRUCTURE Public/Granted day:2018-08-16
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