A DMD chip includes a micromirror array mounted on a very thin silicon wafer attached to a cooling system integrated within the DMD chip. The cooling system includes a fluid cooled heat sink with a cooling channel. Fluid coolant may be pumped through the channel and out of the DMD to remove heat from the silicon substrate and the micromirror array. The micromirror array may be hermetically sealed within the housing, with the heat sink located between the micromirror array and a back wall of the housing, with both the heat sink and the array within the interior of the housing.