Invention Grant
- Patent Title: Array substrate and method of repairing broken lines therefor
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Application No.: US14781313Application Date: 2015-04-01
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Publication No.: US10261374B2Publication Date: 2019-04-16
- Inventor: Shan Li
- Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen, Guangdong
- Agent Leong C. Lei
- Priority: CN201510074075 20150212
- International Application: PCT/CN2015/075685 WO 20150401
- International Announcement: WO2016/127481 WO 20160818
- Main IPC: G02F1/1362
- IPC: G02F1/1362 ; H01L51/52 ; H01L27/12

Abstract:
The present invention provides an array substrate and a method of repairing broken lines therefor. By providing a plurality of apertures on the array substrate correspondingly above the gate scan lines and the source-drain data lines, and the apertures are formed by deposing the passivation layer in the vias of the organic layer to directly form a metal long line by laser chemical vapor deposition between the apertures at two ends of a broken line position to recover a connection of the broken gate scan line or the source-drain data line as implementing broken line repair to the array substrate of the present invention. The method of repairing can omit the process of removing the organic layer by laser to save the time of repairing the broken lines and to effectively eliminate the machine laser waste as removing the organic layer.
Public/Granted literature
- US20180348585A1 ARRAY SUBSTRATE AND METHOD OF REPAIRING BROKEN LINES THEREFOR Public/Granted day:2018-12-06
Information query
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